D. De Silva, R. Nawaratne, J. Ruminski, A. Malinowski, and M. Manic, “Human system interaction in review: Advancing the artificial intelligence transformation,” in 2022 15th International Conference on Human System Interaction (HSI). IEEE, Jul. 2022, p. 1–5.

P. Leitao and S. Karnouskos, “The emergence of ethics engineering in industrial cyber-physical systems,” in 2022 IEEE 5th International Conference on Industrial Cyber-Physical Systems (ICPS). IEEE, May 2022, p. 1–6.

D. Burnett, N. El-Haber, D. Alahakoon, S. Karnouskos, and D. De Silva, Advancing an Artificial Intelligence Ethics Framework for Operator 4.0 in Sustainable Factory Automation. Springer International Publishing, 2022, p. 363–375.

J. She, H. Guzman-Miranda, V. Huang, A. C. Chen, S. Karnouskos, L. Dunai, C. Ma, A. Tisan, and S. Yokota, “A cross-disciplinary outlook of directions and challenges in industrial electronics,” IEEE Open Journal of the Industrial Electronics Society, vol. 3, p. 375–391, 2022.

J. She, H. Guzman-Miranda, V. Huang, A. C. Chen, S. Karnouskos, L. Dunai, A. Tisan, and S. Yokota, “A cross-disciplinary view of industrial electronics: Change, chance, and challenge,” in IECON 2021 – 47th Annual Conference of the IEEE Industrial Electronics Society. IEEE, Oct. 2021, p. 1–7.

A. Walter Colombo, S. Karnouskos, and C. Hanisch, “Engineering human-focused industrial cyber-physical systems in industry 4.0 context,” Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences, vol. 379, no. 2207, p. 20200366, Aug. 2021.

A. W. Colombo, S. Karnouskos, X. Yu, O. Kaynak, R. C. Luo, Y. Shi, P. Leitao, L. Ribeiro, and J. Haase, “A 70-year industrial electronics society evolution through industrial revolutions: The rise and flourishing of information and communication technologies,” IEEE Industrial Electronics Magazine, vol. 15, no. 1, p. 115–126, Mar. 2021.

D. Trentesaux and S. Karnouskos, “Engineering ethical behaviors in autonomous industrial cyber-physical human systems,” Cognition, Technology & Work, vol. 24, no. 1, p. 113–126, Mar. 2021.